National Semiconductor MM54C174J-MIL

表面安装

NO

终端数量

16

Package Style

IN-LINE

Risk Rank

8.79

Max

2000000 Hz

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Part Life Cycle Code

Obsolete

Manufacturer

National Semiconductor Corporation

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

MM54C174J-MIL

Rohs Code

无

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Equivalence Code

DIP16,.3

Package Body Material

CERAMIC

Load Capacitance (CL)

50 pF

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

6

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5/15 V

温度等级

MILITARY

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.00036 A

筛选水平

MIL-STD-883 Class B (Modified)

触发器类型

积极优势