National Semiconductor MM5623BN

表面安装

NO

终端数量

14

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Risk Rank

5.86

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Part Life Cycle Code

Obsolete

Manufacturer

National Semiconductor Corporation

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

MM5623BN

Rohs Code

无

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

JESD-30代码

R-PDIP-T14

资历状况

不合格

电源

5/15 V

温度等级

INDUSTRIAL

逻辑IC类型

NAND GATE

施密特触发器

NO

达到SVHC

compliant