National Semiconductor MM74C921J-3/A

表面安装

NO

终端数量

18

Package Description

DIP, DIP18,.3

Package Style

IN-LINE

Number of Words Code

256

Package Body Material

CERAMIC

Package Equivalence Code

DIP18,.3

Access Time-Max

325 ns

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

MM74C921J-3/A+

Number of Words

256 words

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

National Semiconductor Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

SRAMs

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T18

温度等级

COMMERCIAL

操作模式

ASYNCHRONOUS

组织结构

256X4

输出特性

3-STATE

内存宽度

4

记忆密度

1024 bit

并行/串行

PARALLEL

内存IC类型

标准SRAM