National Semiconductor Corporation CLC031VEC

表面安装

YES

材料

body - nickel-plated brass; seal - silicone rubber

终端数量

64

Gross weight

6.65

Transport package size/quantity

35*30*21/200

Purpose

for pressure equalization in sealed housings and protection from condensation formation

Protection class

IP67

Application area

electrotechnical, lighting, photoelectric, security, automotive and other equipment

Air permeability

not less than 1 l/min at 70 mbar pressure

Mounting hole size

Ф8.2 mm

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Package Description

TFQFP, TQFP64,.47SQ

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TFQFP

Package Equivalence Code

TQFP64,.47SQ

Package Shape

SQUARE

Package Style

FLATPACK, THIN PROFILE, FINE PITCH

JESD-609代码

e0

无铅代码

无

类型

Pressure equalization valve M8X1.25, metal

电阻

hydrostatic pressure - not less than 100 mbar for 30 min

端子表面处理

锡铅

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

235

功能数量

1

端子间距

0.5 mm

Reach合规守则

not_compliant

JESD-30代码

S-PQFP-G64

资历状况

不合格

电源电压-最大值(Vsup)

2.625 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

2.375 V

座位高度-最大

1.2 mm

Operating temperature range

-40…+125 °C

消费者集成电路类型

消费电路

饱和电流

2

长度

10 mm

宽度

10 mm