National Semiconductor Corporation DM74LS00MX

表面安装

YES

材料

aluminium

终端数量

14

Gross Weight

4.95

Transport packaging size/quantity

42*28*27/1000

Maximum current

19 A

Body diameter

14.5 mm

Mounting hole size

Ф12 mm

Mounting method

panel/ solder, sleeve Ф1.9 mm

Part Life Cycle Code

Transferred

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Package Description

SOP,

Load Capacitance (CL)

15 pF

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Shape

RECTANGULAR

Package Style

小概要

Supply Voltage-Nom (Vsup)

5 V

Type of heatsink

extruded

Heatsink shape

grilled

Colour

black

Material finishing

anodized

Mounting

for back plate

Plate thickness

5mm

Connector type

socket (F) Ф4 mm, green isolator color

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

功能数量

4

端子间距

1.27 mm

深度

23.5 (housing); 27.5 (total) mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G14

资历状况

不合格

温度等级

COMMERCIAL

家人

LS

输入数量

2

座位高度-最大

1.75 mm

Operating temperature range

-25+50°C

逻辑IC类型

NAND GATE

传播延迟(tpd)

15 ns

电源电流-最大值(ICC)

4.4 mA

Rated voltage

30 (AC/ DC) V

电压 - 供电 （最大值）

5.25 V

电压 - 供电 （最小值）

4.75 V

第二个连接器加载的位置数

universal

长度

0.1m

宽度

82mm

高度

32mm