Nexperia 74AHC574PW

表面安装

YES

终端数量

20

Package Description

TSSOP, TSSOP20,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

1

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP20,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

74AHC574PW

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Max

75000000 Hz

Risk Rank

8.49

Prop.

13.5 ns

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

功能数量

8

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G20

资历状况

不合格

电源

2/5.5 V

温度等级

AUTOMOTIVE

输出特性

3-STATE

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.008 A

触发器类型

积极优势