参数名
参数值
参数名
参数值
表面安装
YES
引脚数
24
终端数量
24
EU RoHS
供应商未确认
ECCN (US)
EAR99
Automotive
无
PPAP
无
Logic Family
LVC
Data Flow Direction
Bi-Directional
Number of Elements per Chip
1
Number of Channels per Chip
8
Number of Selection Inputs per Element
0
Number of Output Enables per Element
2 Low
Number of Input Enables per Element
4 Low
Number of Direction Control Inputs
0
Bus Hold
无
Absolute Propagation Delay Time (ns)
22.9
Maximum Propagation Delay Time @ Maximum CL (ns)
3.7(Typ)@2.7V|3.2(Typ)@3.3V
Propagation Delay Test Condition (pF)
50
Process Technology
CMOS
Input Level
LVTTL
Maximum Low Level Output Current (mA)
24
Maximum High Level Output Current (mA)
-24
Typical Quiescent Current (uA)
0.1
Maximum Quiescent Current (uA)
40
Minimum Operating Supply Voltage (V)
1.2
Maximum Operating Supply Voltage (V)
3.6
Tolerant I/Os (V)
5
Maximum Power Dissipation (mW)
500
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
125
Mounting
表面贴装
Package Height
0.95(Max)
Package Width
4.5(Max)
Package Length
7.9(Max)
PCB changed
24
Supplier Package
TSSOP
Package Description
TSSOP, TSSOP24,.25
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
TSSOP24,.25
Operating Temperature-Min
-40 °C
Operating Temperature-Max
125 °C
Rohs Code
无
Manufacturer Part Number
74LVC543APW
Supply Voltage-Nom (Vsup)
3.3 V
Package Code
TSSOP
Package Shape
RECTANGULAR
Manufacturer
Philips Semiconductors
Part Life Cycle Code
Transferred
Ihs Manufacturer
飞利浦半导体
Risk Rank
4.69
Prop.
9 ns
JESD-609代码
e0
零件状态
Obsolete
端子表面处理
Tin/Lead (Sn/Pb)
子类别
Bus Driver/Transceivers
包装方式
TUBE
技术
CMOS
端子位置
DUAL
终端形式
鸥翼
功能数量
1
端子间距
0.635 mm
Reach合规守则
unknown
JESD-30代码
R-PDSO-G24
资历状况
不合格
输出类型
3-State
极性
Non-Inverting
电源
3.3 V
温度等级
AUTOMOTIVE
比特数
8
逻辑功能
锁存收发器
输出特性
3-STATE
输出极性
TRUE
逻辑IC类型
注册总线收发器
最大 I(ol)
0.024 A
控制类型
独立控制
计数方向
BIDIRECTIONAL
输出电平
LVTTL