参数名
参数值
参数名
参数值
安装类型
通孔
包装/外壳
14-DIP (0.300, 7.62mm)
供应商器件包装
14-PDIP
ECCN (US)
EAR99
HTS
8542.39.00.01
Logic Family
74C
Number of Elements per Chip
4
Number of Element Inputs
2-IN
Number of Output Enables per Element
0
Number of Selection Inputs per Element
0
Number of Element Outputs
1
Maximum Propagation Delay Time @ Maximum CL (ns)
90@5V|60@10V
Absolute Propagation Delay Time (ns)
90
Process Technology
CMOS
Maximum Low Level Output Current (mA)
8(Min)
Maximum High Level Output Current (mA)
-8(Min)
Minimum Operating Supply Voltage (V)
3
Typical Operating Supply Voltage (V)
5|9|12|3.3
Maximum Operating Supply Voltage (V)
15
Propagation Delay Test Condition (pF)
50
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Standard Package Name
DIP
Supplier Package
DIP
Mounting
通孔
Package Length
19.95(Max)
PCB changed
14
Lead Shape
通孔
Manufacturer Part Number
NTE74C00
Manufacturer
NTE Electronics
Package
Bag
厂商
NTE Electronics, Inc
Product Status
活跃
Package Description
,
Reflow Temperature-Max (s)
未说明
Rohs Code
有
Part Life Cycle Code
活跃
Ihs Manufacturer
NTE ELECTRONICS INC
Risk Rank
2.16
操作温度
-40°C ~ 85°C
系列
-
零件状态
活跃
电压 - 供电
3V ~ 15V
峰值回流焊温度(摄氏度)
未说明
Reach合规守则
unknown
引脚数量
14
电路数量
4
逻辑功能
NAND
输入数量
2
高/低输出电流
-
逻辑类型
NAND门
逻辑IC类型
NAND GATE
最大传播延迟@V,最大CL
60ns @ 10V, 50pF
最大静态电流
15 µA
特征
-
RoHS状态
符合RoHS标准