NXP 2681/BYA

表面安装

YES

终端数量

52

Package Description

DFP, FL52,.7

Package Style

FLATPACK

Package Body Material

CERAMIC

Package Equivalence Code

FL52,.7

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

2681/BYA

Package Code

DFP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

8.73

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Serial IO/Communication Controllers

技术

MOS

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F52

资历状况

不合格

电源

5 V

温度等级

MILITARY

uPs/uCs/外围ICs类型

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

筛选水平

38535Q/M;38534H;883B