NXP 74ABTH16260DL

表面安装

YES

终端数量

56

Risk Rank

5.78

Ihs Manufacturer

飞利浦半导体

Part Life Cycle Code

Transferred

Manufacturer

Philips Semiconductors

Package Shape

RECTANGULAR

Package Code

SSOP

Supply Voltage-Nom (Vsup)

5 V

Manufacturer Part Number

74ABTH16260DL

Rohs Code

无

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Equivalence Code

SSOP56,.4

Package Body Material

PLASTIC/EPOXY

Package Style

SMALL OUTLINE, SHRINK PITCH

Package Description

SSOP, SSOP56,.4

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

其他逻辑IC

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G56

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL