NXP 74LV14PW

表面安装

YES

终端数量

14

Package Description

TSSOP, TSSOP14,.25

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP14,.25

Prop.

28 ns

Risk Rank

5.72

Ihs Manufacturer

飞利浦半导体

Part Life Cycle Code

Transferred

Manufacturer

Philips Semiconductors

Package Shape

RECTANGULAR

Package Code

TSSOP

Supply Voltage-Nom (Vsup)

3.3 V

Manufacturer Part Number

74LV14PW

Rohs Code

有

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G14

资历状况

不合格

电源

3.3 V

温度等级

AUTOMOTIVE

逻辑IC类型

INVERTER

最大 I(ol)

0.016 A

施密特触发器

YES