NXP 74LV4799DB

表面安装

YES

终端数量

16

Package Description

SSOP, SSOP16,.3

Package Style

SMALL OUTLINE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SSOP16,.3

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

74LV4799DB

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.76

子类别

模拟波形生成功能

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

达到SVHC

unknown