NXP 74LV4799DB

表面安装

YES

终端数量

16

Ihs Manufacturer

飞利浦半导体

Manufacturer

Philips Semiconductors

Manufacturer Part Number

74LV4799DB

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SSOP

Package Description

SSOP, SSOP16,.3

Package Equivalence Code

SSOP16,.3

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, SHRINK PITCH

Part Life Cycle Code

Transferred

Risk Rank

5.76

Rohs Code

有

Supply Voltage-Nom (Vsup)

3.3 V

子类别

模拟波形生成功能

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL