NXP 74LVC2G00GM

表面安装

YES

终端数量

8

Ihs Manufacturer

飞利浦半导体

Load Capacitance (CL)

50 pF

Manufacturer

Philips Semiconductors

Manufacturer Part Number

74LVC2G00GM

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

QCCN

Package Description

QCCN, LCC8,.06SQ,20

Package Equivalence Code

LCC8,.06SQ,20

Package Shape

SQUARE

Package Style

CHIP CARRIER

Part Life Cycle Code

Transferred

Prop.

5.4 ns

Risk Rank

5.74

Rohs Code

有

Supply Voltage-Nom (Vsup)

3.3 V

子类别

Gates

包装方式

TAPE AND REEL

技术

CMOS

端子位置

QUAD

终端形式

无铅

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PQCC-N8

资历状况

不合格

电源

3.3 V

温度等级

AUTOMOTIVE

逻辑IC类型

NAND GATE

最大 I(ol)

0.024 A

施密特触发器

NO