NXP 74LVC2G32DP

表面安装

YES

终端数量

8

Ihs Manufacturer

飞利浦半导体

Load Capacitance (CL)

50 pF

Manufacturer

Philips Semiconductors

Manufacturer Part Number

74LVC2G32DP

Operating Temperature-Max

125 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Description

TSSOP, TSSOP8,.16

Package Equivalence Code

TSSOP8,.16

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Part Life Cycle Code

Transferred

Prop.

5.3 ns

Risk Rank

5.69

Rohs Code

有

Supply Voltage-Nom (Vsup)

3.3 V

子类别

Gates

包装方式

TAPE AND REEL

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G8

资历状况

不合格

电源

3.3 V

温度等级

AUTOMOTIVE

逻辑IC类型

OR GATE

最大 I(ol)

0.024 A

施密特触发器

NO