NXP 935277802118

表面安装

YES

终端数量

24

Ihs Manufacturer

NXP SEMICONDUCTORS

Manufacturer

恩智浦半导体

Manufacturer Part Number

935277802118

Number of I/O Lines

16

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Description

4.40 MM, PLASTIC, MO-153, SOT-355-1, TSSOP-24

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Part Life Cycle Code

Obsolete

Risk Rank

5.13

Supply Voltage-Max

5.5 V

Supply Voltage-Min

2.3 V

Supply Voltage-Nom

3 V

ECCN 代码

EAR99

HTS代码

8542.39.00.01

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.65 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G24

温度等级

INDUSTRIAL

端口的数量

2

uPs/uCs/外围ICs类型

PARALLEL IO PORT, GENERAL PURPOSE

座位高度-最大

1.1 mm

长度

7.8 mm

宽度

4.4 mm