NXP 935281363128

表面安装

YES

终端数量

24

Ihs Manufacturer

NXP SEMICONDUCTORS

Manufacturer

恩智浦半导体

Manufacturer Part Number

935281363128

Moisture Sensitivity Levels

1

Number of I/O Lines

8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HVQCCN

Package Description

HVQCCN,

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Part Life Cycle Code

活跃

Risk Rank

5.38

Rohs Code

有

Supply Voltage-Max

2.7 V

Supply Voltage-Min

2.3 V

Supply Voltage-Nom

2.5 V

JESD-609代码

e4

ECCN 代码

EAR99

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

附加功能

IT ALSO OPERATES AT 3.3V SUPPLY

HTS代码

8542.39.00.01

技术

CMOS

端子位置

QUAD

终端形式

无铅

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PQCC-N24

温度等级

INDUSTRIAL

端口的数量

1

uPs/uCs/外围ICs类型

PARALLEL IO PORT, GENERAL PURPOSE

座位高度-最大

1 mm

长度

4 mm

宽度

4 mm