NXP 935282231112

表面安装

YES

终端数量

24

Package Description

TSSOP,

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

2.3 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

935282231112

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

5.5 V

Risk Rank

5.82

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.65 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G24

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, I2C

座位高度-最大

1.1 mm

总线兼容性

I2C

宽度

4.4 mm

长度

7.8 mm