NXP BGS8M2

表面安装

YES

终端数量

6

Ihs Manufacturer

NXP SEMICONDUCTORS

Manufacturer

恩智浦半导体

Manufacturer Part Number

BGS8M2

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BCC

Package Description

BCC,

Package Shape

RECTANGULAR

Package Style

CHIP CARRIER

Part Life Cycle Code

活跃

Risk Rank

5.68

Supply Voltage-Nom

1.8 V

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BUTT

功能数量

1

端子间距

0.4 mm

Reach合规守则

unknown

JESD-30代码

R-PBCC-B6

温度等级

INDUSTRIAL

座位高度-最大

0.4 mm

通信IC类型

射频前端电路

长度

1.1 mm

宽度

0.7 mm