NXP BGS8M2

表面安装

YES

终端数量

6

Package Description

BCC,

Package Style

CHIP CARRIER

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.8 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

BGS8M2

Package Code

BCC

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.68

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BUTT

功能数量

1

端子间距

0.4 mm

JESD-30代码

R-PBCC-B6

温度等级

INDUSTRIAL

座位高度-最大

0.4 mm

通信IC类型

射频前端电路

宽度

0.7 mm

长度

1.1 mm

达到SVHC

unknown