NXP BGY88

触点镀层

Gold

Voltage Rating Max

50VDC/50VAC

Body Orientation

直角

Number of Contact Rows

1

Product Depth (mm)

3.6(mm)

Contact Resistance Max

30(mohm)

Operating Temp Range

-40C to 85C

Termination Method

Solder

Mounting Styles

表面贴装

Contact Materials

Copper Alloy

Pitch (mm)

0.5(mm)

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOT-115C

Operating Temperature-Min

-20 °C

Operating Temperature-Max

100 °C

Manufacturer Part Number

BGY88

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

8.32

包装

卷带

类型

FFC/FPC Connector

子类别

RF/Microwave Amplifiers

技术

HYBRID

Reach合规守则

unknown

接头数量

4(POS)

触点性别

SKT

电源

24 V

电源电流-最大值

340 mA

最大额定电流

0.4/Contact(A)

产品长度(mm)

3.5(mm)

产品高度(mm)

0.9(mm)