NXP BLM6G22-30

Package

Bulk

厂商

PEI-Genesis

Product Status

活跃

Package Description

ROHS COMPLIANT, PLASTIC, SOT834-1, SOP-16

Moisture Sensitivity Levels

3

Rohs Code

有

Manufacturer Part Number

BLM6G22-30

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.74

Part Package Code

SOIC

系列

*

JESD-609代码

e3

无铅代码

有

端子表面处理

Tin (Sn)

HTS代码

8542.39.00.01

Reach合规守则

not_compliant

引脚数量

16