NXP HEF4538BTD

表面安装

YES

终端数量

16

Package Description

SOP, SOP16,.25

Package Style

小概要

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOP16,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

HEF4538BTD

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Risk Rank

5.71

Ihs Manufacturer

飞利浦半导体

JESD-609代码

e4

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

子类别

Prescaler/Multivibrators

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

5/15 V

温度等级

INDUSTRIAL

逻辑IC类型

MONOSTABLE MULTIVIBRATOR