NXP IBS55

表面安装

NO

终端数量

24

Ihs Manufacturer

WALL INDUSTRIES INC

Manufacturer

Wall Industries Inc

Manufacturer Part Number

IBS55

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Output Voltage-Nom

5 V

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP24,.6

Package Shape

RECTANGULAR

Package Style

IN-LINE

Part Life Cycle Code

活跃

Risk Rank

5.75

子类别

其他模拟集成电路

技术

HYBRID

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

compliant

JESD-30代码

R-PDIP-T24

资历状况

不合格

温度等级

INDUSTRIAL

模拟 IC - 其他类型

DC-DC REGULATED POWER SUPPLY MODULE

输出电流-最大值

0.3 A