NXP ISP1160BM，557

表面安装

YES

终端数量

64

Package Description

7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-414-1, LQFP-64

Package Style

FLATPACK, LOW PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP64,.35SQ,16

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

40

Supply Voltage-Min

3 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

ISP1160BM,557

Clock Frequency-Max

6 MHz

Package Code

LFQFP

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.2

Part Package Code

QFP

附加功能

OPERATES AT 5V SUPPLY WITH REGULATOR

子类别

总线控制器

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.4 mm

Reach合规守则

compliant

引脚数量

64

JESD-30代码

S-PQFP-G64

资历状况

不合格

电源

3.3/5 V

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

1.6 mm

地址总线宽度

1

外部数据总线宽度

16

总线兼容性

SH-3; SH-4; ARM7; ARM9; STRONGARM; MIPS

最大数据传输率

15 MBps

宽度

7 mm

长度

7 mm