NXP ISP1564ETUM

表面安装

YES

终端数量

100

Package Description

FBGA, BGA100,10X10,32

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA100,10X10,32

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

ISP1564ETUM

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

ST-Ericsson

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ST-ERICSSON

Risk Rank

5.82

子类别

总线控制器

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B100

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL