NXP ISP1761ET，557

表面安装

YES

终端数量

128

Package Description

TFBGA,

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

SOT-857-1

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.65 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

ISP1761ET,557

Clock Frequency-Max

12 MHz

Package Code

TFBGA

Package Shape

SQUARE

Manufacturer

ST-Ericsson

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ST-ERICSSON

Supply Voltage-Max

1.95 V

Risk Rank

5.33

Part Package Code

BGA

附加功能

ALSO OPERATES AT 3.3V SUPPLY

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

128

JESD-30代码

S-PBGA-B128

资历状况

不合格

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

1.1 mm

地址总线宽度

17

外部数据总线宽度

32

总线兼容性

PCI

宽度

9 mm

长度

9 mm