NXP LH79524

表面安装

YES

终端数量

208

Package Description

FBGA, BGA208,16X16,32

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA208,16X16,32

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Manufacturer Part Number

LH79524

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.65

子类别

其他微处理器集成电路

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B208

资历状况

不合格

电源

1.8,3.3 V

温度等级

INDUSTRIAL