NXP LH7A404-N0F-000

表面安装

YES

终端数量

324

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

CERAMIC

Package Equivalence Code

BGA324,20X20,32

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LH7A404-N0F-000

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

Sharp Corp

Part Life Cycle Code

Transferred

Ihs Manufacturer

SHARP CORP

Risk Rank

5.63

子类别

其他微处理器集成电路

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

JESD-30代码

S-XBGA-B324

资历状况

不合格

电源

1.8,3.3 V

温度等级

INDUSTRIAL

达到SVHC

unknown