参数名
参数值
参数名
参数值
安装类型
表面贴装
包装/外壳
100-LQFP
供应商器件包装
100-LQFP (14x14)
Lead Free Status / RoHS Status
--
Operating Temperature (Max.)
85C
Instruction Set Architecture
RISC
Clock Freq
100(MHz)
DAC Resolution
10
Operating Temperature Classification
Industrial
Package Type
LQFP
Number of Timers - General Purpose
4
Operating Temp Range
-40C to 85C
# I/Os (Max)
70
Power Dissipation (Max)
1500(mW)
Total Internal Ram Size
64KB(kB)
Device Core Size
32(b)
Operating Supply Voltage (Max)
3.6(V)
Operating Supply Voltage (Typ)
3.3(V)
Rad Hardened
无
Operating Supply Voltage (Min)
2.4(V)
Operating Temperature (Min.)
-40C
Programmable
有
Maximum Expanded Memory Size
1GB
Mounting
表面贴装
Moisture Sensitive
有
Maximum Clock Frequency
100 MHz
Number of I/Os
70 I/O
Maximum Operating Temperature
+ 85 C
Supply Voltage-Max
3.3 V
Minimum Operating Temperature
- 40 C
Factory Pack QuantityFactory Pack Quantity
450
Supply Voltage-Min
3.3 V
Mounting Styles
SMD/SMT
Part # Aliases
935288608557
Manufacturer
NXP
Brand
恩智浦半导体
RoHS
Details
Data RAM Size
64 kB
Package
Tray
Base Product Number
LPC1768
厂商
NXP USA Inc.
Data Converters
A/D 8x12b; D/A 1x10b
Product Status
活跃
Package Description
,
Moisture Sensitivity Levels
3
Reflow Temperature-Max (s)
未说明
Rohs Code
有
Manufacturer Part Number
LPC1768FBD100K
Part Life Cycle Code
活跃
Samacsys Description
MCU 32-bit ARM Cortex M3 RISC 512KB Flash 3.3V 100-Pin LQFP Tray
Ihs Manufacturer
NXP SEMICONDUCTORS
Risk Rank
1.69
系列
*
包装
Tray
操作温度
-40°C ~ 85°C (TA)
零件状态
活跃
湿度敏感性等级(MSL)
--
子类别
Microcontrollers - MCU
峰值回流焊温度(摄氏度)
未说明
Reach合规守则
compliant
频率
100(MHz)
引脚数量
100
界面
CAN/Ethernet/Serial
振荡器类型
Internal
速度
100MHz
内存大小
64K x 8
电压 - 供电 (Vcc/Vdd)
2.4V ~ 3.6V
uPs/uCs/外围ICs类型
MICROCONTROLLER, RISC
核心处理器
ARM® Cortex®-M3
周边设备
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
程序存储器类型
Flash
芯尺寸
32-Bit Single-Core
程序内存大小
512 KB
连接方式
CANbus, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
数据总线宽度
32 Bit
产品类别
ARM Microcontrollers - MCU
EEPROM 大小
-
产品类别
ARM Microcontrollers - MCU
设备核心
ARM Cortex M3