NXP LPC2368FET100-T

表面安装

YES

终端数量

100

Ihs Manufacturer

NXP SEMICONDUCTORS

Manufacturer

恩智浦半导体

Manufacturer Part Number

LPC2368FET100-T

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Description

FBGA, BGA100,10X10,32

Package Equivalence Code

BGA100,10X10,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Part Life Cycle Code

Obsolete

RAM(byte)

59392

Risk Rank

5.82

Rohs Code

有

ROM(word)

524288

Supply Voltage-Nom

3.3 V

子类别

Microcontrollers

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B100

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

速度

72 MHz

位元大小

32

处理器系列

ARM7

只读存储器可编程性

FLASH