NXP LPC5526JBD100

表面安装

YES

终端数量

100

Clock Frequency-Max

32 MHz

Ihs Manufacturer

NXP SEMICONDUCTORS

Manufacturer

恩智浦半导体

Manufacturer Part Number

LPC5526JBD100

Number of I/O Lines

64

Package Code

HTFQFP

Package Description

HTFQFP,

Package Shape

SQUARE

Package Style

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Part Life Cycle Code

活跃

Risk Rank

5.77

Supply Voltage-Max

3.6 V

Supply Voltage-Min

1.8 V

Supply Voltage-Nom

3 V

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

速度

150 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

YES

长度

14 mm

宽度

14 mm