NXP NT2H0301F0DTP

表面安装

YES

终端数量

4

Package Description

2 X 1.50 MM, 0.50 MM HEIGHT, PLASTIC, SOT1312-1, HXSON-4

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Moisture Sensitivity Levels

1

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOLCC8,.12,20

Operating Temperature-Min

-25 °C

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

NT2H0301F0DTP

Package Code

HVSON

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.83

JESD-609代码

e4

端子表面处理

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

HTS代码

8542.31.00.01

子类别

Serial IO/Communication Controllers

技术

CMOS

端子位置

DUAL

终端形式

无铅

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-N4

资历状况

不合格

温度等级

OTHER

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

0.5 mm

宽度

1.5 mm

长度

2 mm