NXP XPC823ZT81A

表面安装

YES

终端数量

256

Factory Pack QuantityFactory Pack Quantity

1

Part # Aliases

7-1616364-6

Manufacturer

TE Connectivity

Brand

TE Connectivity / P&B

RoHS

N

Package Description

23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

2.5 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

XPC823ZT81A

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

Transferred

Ihs Manufacturer

FREESCALE SEMICONDUCTOR INC

Risk Rank

5.72

Part Package Code

BGA

ECCN 代码

3A991

HTS代码

8542.31.00.01

子类别

Relays

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

Reach合规守则

compliant

引脚数量

256

JESD-30代码

S-PBGA-B256

温度等级

COMMERCIAL

速度

81 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR

位元大小

32

产品类别

Relay Sockets & Hardware

边界扫描

YES

低功率模式

YES

格式

固定点

集成缓存

YES

产品类别

Relay Sockets & Hardware