NXP XPC823ZT81B2

表面安装

YES

终端数量

256

Ihs Manufacturer

MOTOROLA INC

Manufacturer

摩托罗拉半导体产品

Manufacturer Part Number

XPC823ZT81B2

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Description

BGA, BGA256,16X16,50

Package Equivalence Code

BGA256,16X16,50

Package Shape

SQUARE

Package Style

网格排列

Part Life Cycle Code

Transferred

Risk Rank

8.39

Supply Voltage-Nom

3.3 V

子类别

Microprocessors

端子位置

BOTTOM

终端形式

BALL

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B256

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

速度

81 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

32