NXP Semiconductors 54F240/BRA

表面安装

NO

终端数量

20

ECCN (US)

EAR99

Logic Family

F

HTS

8542.39.00.01

Minimum Operating Supply Voltage (V)

4.5

Maximum High Level Output Current (mA)

-12

Maximum Low Level Output Current (mA)

48

Input Signal Type

Single-Ended

Process Technology

Bipolar

Absolute Propagation Delay Time (ns)

10.5

Maximum Propagation Delay Time @ Maximum CL (ns)

[email protected] to 5.5V

Bus Hold

无

Number of Output Enables per Chip

2 Low

Number of Outputs per Chip

8

Number of Input Enables per Chip

0

Number of Inputs per Chip

8

Number of Channels per Chip

8

Number of Elements per Chip

2

Lead Shape

通孔

PCB changed

20

Package Width

7.87(Max)

Package Length

26.92(Max)

Package Height

3.3(Max)

Mounting

通孔

Supplier Package

CDIP

Standard Package Name

DIP

Supplier Temperature Grade

Military

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-55

Propagation Delay Test Condition (pF)

50

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

5

Package Description

CERAMIC, DIP-20

Package Style

IN-LINE

Load Capacitance (CL)

50 pF

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

54F240/BRA

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.07

Part Package Code

DIP

零件状态

Unconfirmed

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

unknown

引脚数量

20

JESD-30代码

R-GDIP-T20

资历状况

不合格

输出类型

3-State

极性

Inverting

电源电压-最大值(Vsup)

5.5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

端口的数量

2

比特数

4

家人

F/FAST

逻辑功能

Buffer/Line Driver

输出特性

3-STATE

座位高度-最大

5.08 mm

输出极性

INVERTED

逻辑IC类型

总线驱动器

传播延迟(tpd)

5.5 ns

电源电流-最大值(ICC)

75 mA

宽度

7.62 mm

RoHS状态

供应商未确认