NXP Semiconductors BTA216X-600B,127

工厂交货时间

6 Weeks

底架

通孔

表面安装

NO

引脚数

3

质量

2.299997 g

终端数量

3

ECCN (US)

EAR99

Tab

Tab

PCB changed

3

Package Width

4.6(Max)

Package Length

10.3(Max)

Package Height

15.8(Max)

Mounting

通孔

Military

无

Supplier Package

TO-220F

AEC Qualified

Unknown

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-40

AC Switch

无

Circuit Fusing Consideration (A²S)

98

Average Gate Power Dissipation (W)

0.5

Peak Gate Power Dissipation (W)

5

Maximum Latching Current (mA)

90

Repetitive Peak Off-State Current (mA)

0.5

RMS On-State Current (A)

16

Repetitive Peak Forward Blocking Voltage (V)

600

Peak On-State Voltage (V)

1.5@20A

Repetitive Peak Reverse Voltage (V)

600

Maximum Holding Current (mA)

60

Surge Current Rating (A)

150

Maximum Gate Trigger Current (mA)

50

Maximum Gate Trigger Voltage (V)

1.5

Maximum Rate of Rise of On-State Current (A/us)

100

Maximum Rate of Rise of Off-State Voltage (V/us)

4000(Typ)

RoHS

Compliant

Package Description

PLASTIC, FULL PACK-3

Package Style

FLANGE MOUNT

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Max

125 °C

Rohs Code

有

Manufacturer Part Number

BTA216X-600B,127

Package Shape

RECTANGULAR

Manufacturer

WeEn Semiconductor Co Ltd

Number of Elements

1

Part Life Cycle Code

活跃

Ihs Manufacturer

WEEN SEMICONDUCTORS CO LTD

Risk Rank

0.58

包装

Rail

JESD-609代码

e3

零件状态

活跃

端子表面处理

Tin (Sn)

最高工作温度

125 °C

最小工作温度

-40 °C

HTS代码

8541.30.00.80

端子位置

SINGLE

终端形式

THROUGH-HOLE

Reach合规守则

not_compliant

引脚数量

3

参考标准

IEC-134

JESD-30代码

R-PSFM-T3

配置

SINGLE

元素配置

Single

箱体转运

ISOLATED

最大重复反向电压(Vrrm)

600 V

均方根电流(Irms)

16 A

保持电流

60 mA

触发装置类型

无缓冲三端双向可控硅

重复峰值关态电压

600 V

均方根通态电流-最大值

16 A

RoHS状态

是,有豁免

辐射硬化

无