NXP Semiconductors BYV430K-300P

表面安装

NO

Contact plating

gold-plated

Number of pins

4

二极管元件材料

SILICON

终端数量

3

外壳材料

2

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

R-PSFM-T3

Forward Voltage-Max (VF)

1.25 V

Operating Temperature-Max

175 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x4

Gross weight

0.38 g

Operating temperature

-40...163°C

ECCN 代码

EAR99

端子位置

SINGLE

终端形式

THROUGH-HOLE

Reach合规守则

unknown

Current rating

1.5A

参考标准

IEC-60134

JESD-30代码

R-PSFM-T3

配置

COMMON CATHODE, 2 ELEMENTS

二极管类型

接收电极

箱体转运

CATHODE

相位的数量

1

Rep Pk反向电压-最大值

300 V

最大非代表Pk前进电流

330 A

反向电流-最大值

10 μA

Rated voltage

60V

反向恢复时间-最大值

0.055 μs

第二个连接器加载的位置数

超快软恢复能力

个人资料

beryllium copper

Plating thickness

0.75µm

Flammability rating

UL94V-0