NXP Semiconductors I74F86D,623

表面安装

YES

终端数量

14

ECCN (US)

EAR99

Logic Family

F

Number of Elements per Chip

4

Number of Element Inputs

2-IN

Number of Output Enables per Element

0

Number of Selection Inputs per Element

0

Number of Element Outputs

1

Maximum Propagation Delay Time @ Maximum CL (ns)

7@5V

Absolute Propagation Delay Time (ns)

10

Process Technology

Bipolar

Maximum Low Level Output Current (mA)

20

Maximum High Level Output Current (mA)

-1

Minimum Operating Supply Voltage (V)

4.5

PCB changed

14

Package Width

4(Max)

Package Length

8.75(Max)

Package Height

1.45(Max)

Mounting

表面贴装

Supplier Package

SO

Supplier Temperature Grade

Industrial

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

-40

Propagation Delay Test Condition (pF)

50

Maximum Operating Supply Voltage (V)

5.5

Typical Operating Supply Voltage (V)

5

Package Description

SOP,

Package Style

小概要

Moisture Sensitivity Levels

1

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

SOT108-1

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

30

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

I74F86D,623

Supply Voltage-Nom (Vsup)

5 V

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.39

Part Package Code

SOIC

包装

卷带

JESD-609代码

e4

零件状态

Obsolete

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

HTS代码

8542.39.00.01

技术

TTL

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

4

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

14

JESD-30代码

R-PDSO-G14

资历状况

不合格

Brand Name

恩智浦半导体

电源电压-最大值(Vsup)

5.5 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

4.5 V

家人

F/FAST

逻辑功能

XOR

输入数量

2

座位高度-最大

1.75 mm

逻辑IC类型

XOR门

传播延迟(tpd)

8 ns

电源电流-最大值(ICC)

28 mA

宽度

3.9 mm

长度

8.65 mm

RoHS状态

供应商未确认