参数名
参数值
参数名
参数值
表面安装
YES
终端数量
208
ECCN (US)
EAR99
HTS
8542.31.00.01
Family Name
LPC1700
Instruction Set Architecture
RISC
Maximum CPU Frequency (MHz)
120
Maximum Clock Rate (MHz)
120
Data Bus Width (bit)
32
Maximum Expanded Memory Size
1GB
Programmability
有
Interface Type
I2C/I2S/SPI/SSP/UART/USB
Number of I/Os
165
No. of Timers
4
Number of ADCs
Single
ADC Resolution (bit)
12
Number of DAC's
Single
DAC Resolution (bit)
10
USART
0
UART
5
I2C
3
I2S
1
Watchdog
1
Parallel Master Port
无
Real Time Clock
有
Special Features
CAN控制器
Minimum Operating Supply Voltage (V)
2.4
Typical Operating Supply Voltage (V)
3.3
Maximum Operating Supply Voltage (V)
3.6
Maximum Power Dissipation (mW)
1500
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
CECC Qualified
无
Standard Package Name
QFP
Supplier Package
LQFP
Mounting
表面贴装
Package Height
1.45(Max)
Package Length
28.1(Max)
Package Width
28.1(Max)
PCB changed
208
Lead Shape
Gull-wing
Package Description
28 X 28 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT459-1, LQFP-208
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
Moisture Sensitivity Levels
2
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
QFP208,1.2SQ,20
Operating Temperature-Min
-40 °C
Supply Voltage-Nom
3.3 V
Reflow Temperature-Max (s)
30
Supply Voltage-Min
2.4 V
Operating Temperature-Max
85 °C
Rohs Code
有
Manufacturer Part Number
LPC1785FBD208
RAM(byte)
81920
Clock Frequency-Max
25 MHz
Package Code
LFQFP
Package Shape
SQUARE
Manufacturer
恩智浦半导体
ROM(word)
262144
Part Life Cycle Code
活跃
Number of I/O Lines
165
Ihs Manufacturer
NXP SEMICONDUCTORS
Supply Voltage-Max
3.6 V
Risk Rank
5.75
Part Package Code
QFP
JESD-609代码
e3
零件状态
活跃
端子表面处理
Tin (Sn)
HTS代码
8542.31.00.01
子类别
Microcontrollers
技术
CMOS
端子位置
QUAD
终端形式
鸥翼
峰值回流焊温度(摄氏度)
260
端子间距
0.5 mm
Reach合规守则
compliant
引脚数量
208
JESD-30代码
S-PQFP-G208
资历状况
不合格
电源
3.3 V
温度等级
INDUSTRIAL
速度
120 MHz
内存大小
80KB
uPs/uCs/外围ICs类型
MICROCONTROLLER, RISC
程序存储器类型
Flash
程序内存大小
256KB
电源电流-最大值
100 mA
位元大小
32
有ADC
YES
DMA 通道
YES
脉宽调制通道
YES
数模转换器通道
1
座位高度-最大
1.6 mm
地址总线宽度
26
核心架构
ARM
外部数据总线宽度
32
以太网
0
USB
1
只读存储器可编程性
FLASH
SPI,SPI
1
CAN
0
脉宽调制
2
ADC Channels
8
设备核心
ARM Cortex M3
宽度
28 mm
长度
28 mm
RoHS状态
符合RoHS标准