NXP Semiconductors LPC1830FET100

表面安装

YES

引脚数

100

终端数量

100

ADC Resolution (bit)

10/10

Number of DAC's

Single

DAC Resolution (bit)

10

USART

3

UART

1

I2C

2

I2S

2

Watchdog

1

Special Features

CAN控制器

ECCN (US)

EAR99

Family Name

LPC1800

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

150

Maximum Clock Rate (MHz)

150

Data Bus Width (bit)

32

Programmability

无

Interface Type

CAN/I2C/I2S/Ethernet/SPI/UART/USART/USB

Number of I/Os

49

No. of Timers

6

Number of ADCs

Dual

Minimum Operating Supply Voltage (V)

2.2

Typical Operating Supply Voltage (V)

2.5|3.3

Maximum Operating Supply Voltage (V)

3.6

Maximum Power Dissipation (mW)

1500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

CECC Qualified

无

Standard Package Name

BGA

Supplier Package

TFBGA

Mounting

表面贴装

Package Height

0.8(Max)

Package Length

9.1(Max)

Package Width

9.1(Max)

PCB changed

100

Lead Shape

Ball

Package Description

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

SOT-926-1

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

2.2 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LPC1830FET100

Clock Frequency-Max

25 MHz

Package Code

TFBGA

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

活跃

Number of I/O Lines

49

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.71

Part Package Code

BGA

零件状态

活跃

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B100

温度等级

INDUSTRIAL

速度

180 MHz

内存大小

200KB

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

程序存储器类型

ROMLess

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

NO

数模转换器通道

1

座位高度-最大

1.2 mm

地址总线宽度

24

核心架构

ARM

外部数据总线宽度

32

以太网

1

USB

2

只读存储器可编程性

FLASH

SPI,SPI

4

CAN

2

脉宽调制

1

ADC Channels

4/4

设备核心

ARM Cortex M3

宽度

9 mm

长度

9 mm

RoHS状态

符合RoHS标准