NXP Semiconductors LPC1830FET100

表面安装

YES

终端数量

100

ECCN (US)

EAR99

Family Name

LPC1800

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

150

Maximum Clock Rate (MHz)

150

Data Bus Width (bit)

32

Programmability

无

Interface Type

CAN/I2C/I2S/Ethernet/SPI/UART/USART/USB

Number of I/Os

49

No. of Timers

6

Number of ADCs

Dual

ADC Resolution (bit)

10/10

Number of DAC's

Single

DAC Resolution (bit)

10

USART

3

UART

1

I2C

2

I2S

2

Watchdog

1

Special Features

CAN控制器

Minimum Operating Supply Voltage (V)

2.2

Typical Operating Supply Voltage (V)

2.5|3.3

Maximum Operating Supply Voltage (V)

3.6

Maximum Power Dissipation (mW)

1500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

CECC Qualified

无

Standard Package Name

BGA

Supplier Package

TFBGA

Mounting

表面贴装

Package Height

0.8(Max)

Package Length

9.1(Max)

Package Width

9.1(Max)

PCB changed

100

Lead Shape

Ball

Package Description

9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

SOT-926-1

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

2.2 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LPC1830FET100

Clock Frequency-Max

25 MHz

Package Code

TFBGA

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

活跃

Number of I/O Lines

49

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.71

Part Package Code

BGA

零件状态

活跃

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

0.8 mm

Reach合规守则

compliant

引脚数量

100

JESD-30代码

S-PBGA-B100

温度等级

INDUSTRIAL

速度

180 MHz

内存大小

200KB

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

程序存储器类型

ROMLess

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

NO

数模转换器通道

1

座位高度-最大

1.2 mm

地址总线宽度

24

核心架构

ARM

外部数据总线宽度

32

以太网

1

USB

2

只读存储器可编程性

FLASH

SPI,SPI

4

CAN

2

脉宽调制

1

ADC Channels

4/4

设备核心

ARM Cortex M3

宽度

9 mm

长度

9 mm

RoHS状态

符合RoHS标准