NXP Semiconductors LPC1857FET256

表面安装

YES

终端数量

256

ECCN (US)

EAR99

HTS

8542.31.00.01

Family Name

LPC1800

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

180

Maximum Clock Rate (MHz)

180

Data Bus Width (bit)

32

Programmability

有

Interface Type

CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB

Number of I/Os

164

No. of Timers

6

Number of ADCs

Dual

ADC Resolution (bit)

10/10

Number of DAC's

Single

USART

3

UART

4

I2C

1

I2S

2

Watchdog

1

Special Features

CAN控制器

Minimum Operating Supply Voltage (V)

2.2

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Maximum Power Dissipation (mW)

1500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

CECC Qualified

无

Standard Package Name

BGA

Supplier Package

LBGA

Mounting

表面贴装

Package Height

1.1(Max)

Package Length

17.2(Max)

Package Width

17.2(Max)

PCB changed

256

Lead Shape

Ball

Part Package Code

BGA

Risk Rank

5.71

Supply Voltage-Max

3.6 V

Ihs Manufacturer

NXP SEMICONDUCTORS

Number of I/O Lines

164

Part Life Cycle Code

活跃

Manufacturer

恩智浦半导体

Package Shape

SQUARE

Package Code

LBGA

Clock Frequency-Max

25 MHz

Manufacturer Part Number

LPC1857FET256

Rohs Code

有

Operating Temperature-Max

85 °C

Supply Voltage-Min

2.2 V

Supply Voltage-Nom

3.3 V

Operating Temperature-Min

-40 °C

Manufacturer Package Code

SOT-740-1

Package Body Material

PLASTIC/EPOXY

Moisture Sensitivity Levels

3

Package Style

GRID ARRAY, LOW PROFILE

Package Description

LBGA,

JESD-609代码

e1

零件状态

活跃

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

1 mm

Reach合规守则

compliant

时间@峰值回流温度-最大值(s)

30

引脚数量

256

JESD-30代码

S-PBGA-B256

温度等级

INDUSTRIAL

速度

180 MHz

内存大小

136KB

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

程序存储器类型

Flash

程序内存大小

1MB

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

YES

数模转换器通道

YES

座位高度-最大

1.55 mm

地址总线宽度

24

核心架构

ARM

外部数据总线宽度

32

以太网

1

USB

2

只读存储器可编程性

FLASH

SPI,SPI

4

CAN

2

脉宽调制

1

ADC Channels

8/8

设备核心

ARM Cortex M3

长度

17 mm

宽度

17 mm

RoHS状态

符合RoHS标准