NXP Semiconductors LPC2210FBD144/01K

安装类型

表面贴装

包装/外壳

144-LQFP

供应商器件包装

144-LQFP (20x20)

ECCN (US)

EAR99

HTS

8542.31.00.01

Family Name

LPC2000

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

60

Maximum Clock Rate (MHz)

60

Data Bus Width (bit)

16|32

Programmability

无

Interface Type

I2C/SPI

Number of I/Os

76

No. of Timers

2

Number of ADCs

Single

ADC Resolution (bit)

10

USART

0

UART

0

I2C

1

I2S

0

Minimum Operating Supply Voltage (V)

3|1.65|2.5

Typical Operating Supply Voltage (V)

1.8|3.3

Maximum Operating Supply Voltage (V)

1.95|3.6

Maximum Power Dissipation (mW)

1500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Standard Package Name

QFP

Supplier Package

LQFP

Mounting

表面贴装

Package Height

1.45(Max)

Package Length

20.1(Max)

Package Width

20.1(Max)

PCB changed

144

Lead Shape

Gull-wing

Moisture Sensitive

有

Factory Pack QuantityFactory Pack Quantity

300

Part # Aliases

935282078557

Manufacturer

NXP

Brand

恩智浦半导体

RoHS

Details

Package

Bulk

Base Product Number

LPC2210

厂商

NXP USA Inc.

Data Converters

A/D 8x10b

Product Status

活跃

Maximum Clock Frequency

75 MHz

Maximum Operating Temperature

+ 85 C

Supply Voltage-Max

1.95 V

Minimum Operating Temperature

- 40 C

Supply Voltage-Min

1.65 V

Mounting Styles

SMD/SMT

Data RAM Size

16 kB

包装

Tray

操作温度

-40°C ~ 85°C (TA)

系列

LPC2200

零件状态

活跃

子类别

Microcontrollers - MCU

引脚数量

144

工作电源电压

1.65 V to 1.95 V

振荡器类型

Internal

速度

75MHz

内存大小

16KB

电压 - 供电 (Vcc/Vdd)

1.65V ~ 3.6V

核心处理器

ARM7®

周边设备

POR, PWM, WDT

程序存储器类型

ROMLess

芯尺寸

16/32-Bit

程序内存大小

-

连接方式

EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART

数据总线宽度

32 bit/16 bit

产品类别

ARM Microcontrollers - MCU

核心架构

ARM

EEPROM 大小

-

以太网

0

USB

0

SPI,SPI

2

CAN

0

产品类别

ARM Microcontrollers - MCU

ADC Channels

8

设备核心

ARM7TDMI-S

RoHS状态

符合RoHS标准