NXP Semiconductors LPC2368FBD100-S

表面安装

YES

引脚数

100

终端数量

100

ECCN (US)

EAR99

HTS

8542.31.00.01

Family Name

LPC2300

Instruction Set Architecture

RISC

Lead Shape

Gull-wing

PCB changed

100

Package Width

14.1(Max)

Package Length

14.1(Max)

Package Height

1.45(Max)

Mounting

表面贴装

Supplier Package

LQFP

Standard Package Name

QFP

CECC Qualified

无

Maximum Operating Temperature (°C)

85

Minimum Operating Temperature (°C)

-40

Maximum Power Dissipation (mW)

1500

Maximum Operating Supply Voltage (V)

3.6

Typical Operating Supply Voltage (V)

3.3

Minimum Operating Supply Voltage (V)

3

Special Features

CAN控制器

Real Time Clock

有

Parallel Master Port

无

Watchdog

1

I2S

1

I2C

3

UART

4

USART

0

DAC Resolution (bit)

10

Number of DAC's

Single

ADC Resolution (bit)

10

Number of ADCs

Single

Timers Resolution (bit)

32/32/32/32

No. of Timers

4

Number of I/Os

70

Interface Type

CAN/Ethernet/I2C/I2S/SPI/UART/USB

Programmability

有

Maximum Expanded Memory Size

4GB

Data Bus Width (bit)

32|16

Maximum Clock Rate (MHz)

72

Maximum CPU Frequency (MHz)

72

Package Description

QFP, QFP100,.63SQ,20

Package Style

FLATPACK

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP100,.63SQ,20

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

LPC2368FBD100-S

RAM(byte)

59392

Package Code

QFP

Package Shape

SQUARE

Manufacturer

恩智浦半导体

ROM(word)

524288

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

8.6

包装

Tray

零件状态

活跃

子类别

Microcontrollers

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G100

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL

速度

72 MHz

内存大小

58KB

程序存储器类型

Flash

程序内存大小

512KB

电源电流-最大值

100 mA

位元大小

32

数模转换器通道

1

核心架构

ARM

处理器系列

ARM7

以太网

1

USB

1

只读存储器可编程性

FLASH

SPI,SPI

1

CAN

2

脉宽调制

1

ADC Channels

6

设备核心

ARM7TDMI-S

RoHS状态

符合RoHS标准