NXP Semiconductors LPC2888FET180,551

表面安装

YES

终端数量

180

ECCN (US)

3A991.a.2

Family Name

LPC2000

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

60

Maximum Clock Rate (MHz)

60

Data Bus Width (bit)

32|16

Programmability

有

Interface Type

I2C/I2S/UART/USB

Number of I/Os

81

No. of Timers

2

Number of ADCs

Single

ADC Resolution (bit)

10

USART

0

UART

1

I2C

1

I2S

1

Watchdog

1

Minimum Operating Supply Voltage (V)

3|1.7

Typical Operating Supply Voltage (V)

1.8|3.3

Maximum Operating Supply Voltage (V)

1.95|3.6

Maximum Power Dissipation (mW)

1500

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

CECC Qualified

无

Standard Package Name

BGA

Supplier Package

TFBGA

Mounting

表面贴装

Package Height

0.84(Max)

Package Length

10.1(Max)

Package Width

10.1(Max)

PCB changed

180

Lead Shape

Ball

Package Description

TFBGA,

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

SOT-640-1

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.8 V

Supply Voltage-Min

1.7 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

LPC2888FET180,551

Clock Frequency-Max

20 MHz

Package Code

TFBGA

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Number of I/O Lines

85

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

1.95 V

Risk Rank

5.83

Part Package Code

BGA

包装

Tray

零件状态

Obsolete

附加功能

ALSO REQUIRES 3.3V SUPPLY

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

180

JESD-30代码

S-PBGA-B180

资历状况

不合格

温度等级

INDUSTRIAL

速度

60 MHz

内存大小

64KB

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

程序存储器类型

Flash

程序内存大小

1MB

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

NO

数模转换器通道

YES

座位高度-最大

1.11 mm

地址总线宽度

21

核心架构

ARM

外部数据总线宽度

16

以太网

0

USB

1

只读存储器可编程性

FLASH

SPI,SPI

0

CAN

0

ADC Channels

5

设备核心

ARM7TDMI-S

宽度

10 mm

长度

10 mm

RoHS状态

符合RoHS标准