NXP Semiconductors LPC812M101JDH20

表面安装

YES

引脚数

20

终端数量

20

ECCN (US)

EAR99

Family Name

LPC800

Instruction Set Architecture

RISC

Maximum CPU Frequency (MHz)

30

Maximum Clock Rate (MHz)

30

Data Bus Width (bit)

32

Programmability

有

Interface Type

I2C/SPI/USART

Number of I/Os

18

No. of Timers

3

USART

3

UART

0

I2C

1

I2S

0

Watchdog

1

Analog Comparators

1

Parallel Master Port

无

Real Time Clock

无

Minimum Operating Supply Voltage (V)

1.8

Typical Operating Supply Voltage (V)

3.3

Maximum Operating Supply Voltage (V)

3.6

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

CECC Qualified

无

Standard Package Name

SOP

Supplier Package

TSSOP

Mounting

表面贴装

Package Height

0.95(Max)

Package Length

6.6(Max)

Package Width

4.5(Max)

PCB changed

20

Lead Shape

Gull-wing

Package Description

TSSOP,

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Supply Voltage-Min

1.8 V

Operating Temperature-Max

105 °C

Manufacturer Part Number

LPC812M101JDH20

RAM(byte)

4096

Clock Frequency-Max

25 MHz

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

ROM(word)

16384

Part Life Cycle Code

活跃

Number of I/O Lines

18

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

3.6 V

Risk Rank

5.71

零件状态

活跃

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.65 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G20

温度等级

INDUSTRIAL

速度

30 MHz

内存大小

4KB

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

程序存储器类型

Flash

程序内存大小

16KB

位元大小

32

有ADC

NO

DMA 通道

NO

脉宽调制通道

YES

数模转换器通道

NO

座位高度-最大

1.1 mm

核心架构

ARM

片上程序 ROM 宽度

8

以太网

0

USB

0

只读存储器可编程性

FLASH

SPI,SPI

2

CAN

0

设备核心

ARM Cortex M0+

宽度

4.4 mm

长度

6.5 mm

RoHS状态

符合RoHS标准