NXP Semiconductors LS1023ASE8KQA

表面安装

YES

终端数量

780

ECCN (US)

5A002.a.1

HTS

8542.31.00.01

Family Name

QorIQ LS1023A

Instruction Set Architecture

RISC

Number of CPU Cores

2

Data Bus Width (bit)

64

Instruction Cache Size

32KB

Maximum Speed (MHz)

1000

Interface Type

Ethernet/I2C/SPI/UART/USB

UART

8

USART

0

Data Cache Size

32KB

Multiply Accumulate

无

I2C

4

I2S

0

Memory Card Interface

SD/MMC

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

105

Supplier Package

FBGA

Mounting

表面贴装

Package Height

1.62

Package Length

23

Package Width

23

PCB changed

780

Package Description

FBGA,

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

0.9 V

Supply Voltage-Min

0.87 V

Operating Temperature-Max

105 °C

Manufacturer Part Number

LS1023ASE8KQA

Clock Frequency-Max

1400 MHz

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Supply Voltage-Max

0.93 V

Risk Rank

5.73

包装

Tray

零件状态

活跃

附加功能

ALSO OPERATES AT 1V SUPPLY NOM

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

引脚数量

780

JESD-30代码

S-PBGA-B780

温度等级

OTHER

座位高度-最大

2.07 mm

地址总线宽度

14

核心架构

ARM

边界扫描

YES

外部数据总线宽度

32

以太网

6

USB

3

总线兼容性

ETHERNET, I2C, PCI, SATA, SPI, UART, USB

SPI,SPI

4

CAN

0

设备核心

ARM Cortex A53

宽度

23 mm

长度

23 mm

RoHS状态

符合RoHS标准