NXP Semiconductors MC12311

表面安装

YES

终端数量

60

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

8 X 8 MM, 0.50 MM PITCH, LGA-60

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

UNSPECIFIED

Package Code

VFLGA

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Nom

3.3 V

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BUTT

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-XBGA-B60

温度等级

INDUSTRIAL

座位高度-最大

0.98 mm

通信IC类型

电信电路

长度

8 mm

宽度

8 mm