NXP Semiconductors MCIMX353DJQ5C

工厂交货时间

18 Weeks

表面安装

YES

终端数量

400

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Moisture Sensitivity Levels

3

Operating Temperature-Max

70 °C

Operating Temperature-Min

-20 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA400,20X20,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

1.47 V

Supply Voltage-Min

1.33 V

Supply Voltage-Nom

1.8 V

JESD-609代码

e1

ECCN 代码

5A992.C

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

附加功能

IT ALSO OPERATES AT 1.22 TO 1.47 V

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

0.8 mm

Reach合规守则

compliant

时间@峰值回流温度-最大值(s)

40

JESD-30代码

S-PBGA-B400

资历状况

不合格

温度等级

OTHER

uPs/uCs/外围ICs类型

SoC

座位高度-最大

1.6 mm

长度

17 mm

宽度

17 mm