NXP Semiconductors MK61FN1M0CAA12

Contact plating

gold-plated

表面安装

YES

Number of pins

27

终端数量

143

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x27

Gross weight

2.57 g

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

FBGA,

Clock Frequency-Max

32 MHz

Number of I/O Lines

79

Package Code

FBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Max

3.6 V

Supply Voltage-Min

1.71 V

Supply Voltage-Nom

3.3 V

Operating temperature

-40...163°C

ECCN 代码

3A991.A.2

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.4 mm

Reach合规守则

unknown

Current rating

1.5A

速度

120 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER, RISC

位元大小

32

有ADC

YES

DMA 通道

YES

脉宽调制通道

YES

Rated voltage

60V

个人资料

beryllium copper

长度

6.44 mm

宽度

5.55 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0