NXP Semiconductors NE5044N

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-20 °C

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

NE5044N

Supply Voltage-Nom (Vsup)

10 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

8.53

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

其他模拟集成电路

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

10 V

温度等级

COMMERCIAL